Microstructure and Thermal Analysis of Lead-Free Solder for Environmentally friendly Electronics

¹ Mechanical Engineering Department, Univeristas Muhammadiyah Yogyakarta, Jl Brawijaya, Tamantirto, Kasihan, Bantul, Yogyakarta, Indonesia, 55183
² Mechanical Engineering Department, Univeristas Muhammadiyah Surakarta, Jl. A. Yani, Mendungan, Pabelan, Kec. Kartasura, Kabupaten Sukoharjo, Jawa Tengah 57162
³ Faculty of Mechanical Engineering & Technolog, Univerisiti Malaysia Perlis, Universiti Malaysia Perlis, Pauh Putra Alam Campus 02600 Arau, Perlis

^* Corresponding author: This email address is being protected from spambots. You need JavaScript enabled to view it.

Abstract

The transition from traditional Sn-Pb solders to lead-free alternatives has become a critical challenge in the electronics industry due to environmental and health concerns. This study investigates the thermal behavior, microstructure, and mechanical properties of a commercial SAC305 lead-free solder alloy. Thermal characteristics were examined using cooling curve analysis and Differential Scanning Calorimetry (DSC), revealing a melting point around 216°C—significantly higher than the eutectic Sn-Pb solder. Microstructural analysis using optical microscopy demonstrated a distinct dendritic structure typical of Sn-Ag-Cu alloys. Vickers hardness testing showed an average hardness of 22.4 HV, indicating superior mechanical strength compared to Sn60-Pb40 solder, which measured 16.88 HV. The enhanced mechanical and thermal stability of the SAC305 alloy, along with its compliance with RoHS directives, confirms its potential as a reliable, environmentally friendly alternative to conventional lead-based solders in electronic assembly. However, its higher melting point necessitates careful control of soldering processes to minimize thermal stress on electronic components.