Physicochemical and sensory analysis of wafers with different types of tahini fillings

¹ Department of Tobacco, Sugar, Vegetable and Essential Oils, University of Food Technologies, Plovdiv, Bulgaria
² Department of Tourism and Culinary Management, University of Food Technologies, Plovdiv, Bulgaria

^* Corresponding author: This email address is being protected from spambots. You need JavaScript enabled to view it.

Abstract

Wafers are popular low-moisture confectionery products, typically composed of thin baked sheets and sweet fillings, which provide extended shelf life and distinctive texture. This study investigates the influence of different tahini-based fillings on the sensory and physicochemical properties of wafers. Tahini, a nutrient-dense paste from roasted oil-bearing seeds, offers high dry matter content (98.42–99.53%) and functional health benefits, making it a suitable long-life ingredient. Four tahini types: sesame, peanut, sunflower and hazelnut, were incorporated into fillings, and their hygroscopic behavior at φ = 68% relative humidity was assessed. Sensory analysis revealed that tahini fillings reduced wafer crispiness across all variants, likely due to moisture migration into wafer sheets. Sweetness perception varied, with sesame tahini wafers rated sweetest and sunflower tahini wafers least sweet, while hazelnut and peanut variants showed no significant difference. Hedonic evaluation ranked hazelnut tahini wafers highest for appearance and texture, and peanut tahini wafers highest for aroma and taste, whereas sesame tahini wafers received the lowest ratings overall. The results highlight that tahini type significantly influences wafer hygroscopicity, sensory attributes, and consumer acceptability.