BIO Web of Conferences

Journals
Books
Conferences

EDPS Account

Login

All issues
Series
Forthcoming
About

Search

Menu

Browse
About the journal
For conference organizers
For authors
News
All open access proceedings journals
FAQ
Contact
Client feedback
Request a quote

Advanced Search

Search

Browse
About the journal
For conference organizers
For authors
News
All open access proceedings journals
FAQ
Contact
Client feedback
Request a quote

Advanced Search
Help

Microstructure and Thermal Analysis of Lead-Free Solder for Environmentally friendly Electronics

Aris Widyo Nugroho, Andika Wiguna, Yogy Dony Rojabudin, Muhammad Tri Marjianto, Muhammad Budi Nur Rahman, Ngafwan Ngafwan, Mohd Ridzuan Mohd Jamir and Totok Suwanda

BIO Web Conf., 199 (2025) 02008

Published online: 05 December 2025

DOI: 10.1051/bioconf/202519902008

This search tool will display articles in Google Scholar database by authors of the selected article:

Select your author(s):

Aris Widyo Nugroho

Andika Wiguna

Yogy Dony Rojabudin

Muhammad Tri Marjianto

Muhammad Budi Nur Rahman

Ngafwan Ngafwan

Mohd Ridzuan Mohd Jamir

Totok Suwanda

Select all
Remove all

Search method:

Articles written by ALL the selected authors (AND)

Articles written by ANY OF the selected authors (OR)

BIO Web of Conferences

eISSN: 2117-4458

Mentions légales
Contacts
Privacy policy

A Vision4Press website